Printed Circuit Board Surface Treatment Service
Printed Circuit Board Surface Treatment Service
At Plamex, we leverage the technology and experience we have cultivated over many years in the manufacturing of resin parts and plastic plating to develop advanced manufacturing techniques that leave competitors behind in this field, responding to the various needs of our users (compact, lightweight, high quality, high performance). ■ Copper Plating Division We provide special materials such as Teflon substrates without the usual roughening treatment, using our unique method to offer safe and low-cost solutions. Additionally, we can perform copper plating with excellent adhesion on the window portions of rigid flex boards and multilayer flex boards. ■ Roll to Roll Division For FPC manufacturers that handle sheet materials, we can process everything from material procurement to drilling and through-hole copper plating, offering products as "roll-type TH copper plated items." It is also possible to vary the copper plating thickness on the front and back of the roll substrate (e.g., 5μ on the front and 10μ on the back). ■ Gold Plating Division We have one line for terminal plating and two lines for electrolytic gold plating. The capacity for terminal gold plating is 1,000 pieces per day, and for electrolytic gold plating, it is 500m² per day. For more details, please check the "Catalog Download."
- Company：プラメックス
- Price：Other
